1.Number of floors：14L
2.Plate thickness：2.6mm
3.Material：TU-862HF
4.Surface treatment：OSP+gold deposit
5.Minimum line width/line spacing：75/75μm
6.Minimum hole diameter：0.25mm
7.Special processes：
1.Design of male and female copper of core layer
2.Plasma process
3.Aspect ratio 10.4:1
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