16-layer through-hole board

1.M2 High-Speed Material

2.Double-Sided Back Drilling

3.Metal Edging

4.POFV Process

5.100% Via Fill

6.7-Core Single Lamination

7.BGA High Appearance

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：Room 306,A4 Building,3rd Industrial Zone,Huaide,Fuyong Street,Bao'an District,Shenzhen,China

： A1 Building,Ditang Industrail B zone,Shajing Street,Bao'an District,Shenzhen, China

：+86 13244860273