PCB

 

1.Base Material:99.6% Aluminium Oxide

2.Substrate Thickness:0.5mm

3.Min.line Width/Space:0.10mm/0.10mm

4.Surface treatment:Front:Ni/Au≥4μm;Back:Ni/Au≥0.5μm;

5.Applications:Aviation, aerospace, weapon

6.special Process:Through hole filling: Φ0.2mm; 

7.Surface copper: 5±1μm; Rz≤2μm


Power Module Carrier
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Room 306,A4 Building,3rd Industrial Zone,Huaide,Fuyong Street,Bao'an District,Shenzhen,China

sales@sunkeypcb.com       

: A1 Building,Ditang Industrail B zone,Shajing Street,Bao'an District,Shenzhen, China   

:+86 13244860273

                                                                                  


 

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